CPC is a highly qualified, surface-mount, PCB assembly house. We provide both surface mount prototyping and volume production runs by means of both manual and automatic SMD assembly procedures. Single- and double-sided placement is executed by our trained assembly technicians. By utilizing CPC's PCB assembly services, you can focus on your circuit and layout designs while we ensure your PCBs are fabricated and assembled according to your design specifications.
We have the capabilities to assemble the following: BGA, QFN, SOIC, PLCC, QFP, uBGA. POP. We also can assemble a variety of other minute chip packages having a pitch of 0.2 mm (8 mils) or bigger. We are fully capable of assembling through-hole components. Our staff is able to work with chip packages as tiny as 0201 for passive components.
Surface-Mount Technology (SMT) Assembly
We Match Your Design Specification
X-ray inspection is used to test the solder joint SMD quality. Direct visual inspection is not possible for leadless components such as QFN, DFN and BGA packages. We use 3D X-ray inspection, which is vital for detecting related problems with SMT soldering on BGA assemblies. We would be pleased to take up your assignment, and you will get ample support from us, irrespective of which design stage you are at.
Our professionals offer design for manufacturing guidance at the very first stage of your design. We will willingly provide fast lead times for prototypes and utmost flexibility for your production runs throughout your project with us.